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● Arch bridge type suspending direct-connected scraper, programmable printing head
● Double sliders ensures the printing head moving accuracy and stability when scraper is running back and forth.
● Programmable motor controls conveying speed and conveys PCB in the precise position
● The cleaning unit is separated from CCD camera, which can minimize the load of motor, improve the positioning precision and speed.
● Automatic conveyor width adjustment.
● Auto stencil cleaning(Dry/Wet/Vacuum).
● Automatic 2D paste inspection.
| ● Arch bridge type suspending direct-connected scraperprogrammable printing head. ● Double sliders ensures the printing head moving accuracyand stability when scraper is running back and forth. |
| ● Special platform calibration: Three axes linkage is designed with super-high dynamic characteristics to achieve high precision platform calibration. |
| ● The cleaning unit is separated from CCD camera, whichcan minimize the camera & stop axis load, improve the PCB positioning precision and speed. ● Stencil cleaning system is automatic and effective. Threemodels of Dry cleaning. Wet cleaning and Vacuum cleaningcan be selected to use individually and multiply. |
| ● Unique belt transmission system avoids being stuck or fall-off of PCB Programmable motor controls conveying speedand conveys PCB in the precise position ● Conveyor width can be automatically adjusted |
| ● Uniform ring light, high brightness coaxial light and advanced upper/lower visionsystem Full range of light compensation, Automatic and accurate recognized of alltype MARK points. Applicable for tin plating, copper plating, gold plating, tin spraying. FPC and other types PCB with different colors, able to ensure high accuracy |
| ● Using Windows 10 operation interface, and easy to learn for user. Programming is designed with teaching and navigation function, guidance is available on every step. |
| ● High quality electrical parts ensure machine long service life. |
| Stencil Cleaning System ● 3 types of under stencil cleaning: dry, wet and vacuum. These 3 modescan be individually selected or combined for using. System allows manual cleaning within its operation menu which shortens cleaning time andiimproves production efficiency. |
| Before Cleaning ● Blocked the opening of stencil by solder pasteand choose 2 areas (lC and BGA ) to checkcleaning result. |
| Cleaning Result ● Conclusion: blocked holes and IC can be cleaned completely. Customer could set up cleaning module (wet, dry andvacuum modes) depends on difficulty of stencil to improve productivity and ensure cleaning quality. |
| Printing Result Comparation 500X Microscope Inspection ● Conclusion: Printingresultis perfect, nomisalignment, shift, solderbridge, lacksolder, etc. |
| ● Use same sample to test H9 and other brand to check IC and BGA. |
| Printing Result Comparation (SPI) SPI inspection SPI inspection result: Production QTY: 192PCS Pass QTY: 189PCS Defective QTY: 3PCS Pass rate: 98.438% Defective rate: 1.562% |
| ● Conclusion: This PCB has many difficult IC and small pads, after inspection, result is good, H9 can ensure printing quality and accuracy in production line. |
Fully Automatic Screen Printer H900 Specification： | |||
Model | H900 | ||
Screen Frames | Min Size | 737X400mm | |
| Max Size | 100X850mm | ||
| Thickness | 900X610mm | ||
PCB Min Size | 80×50mm | ||
PCB Max Size | 650×610mm | ||
PCB Thickness | 0.4~6mm | ||
PCB Warpage | <1% | ||
Transport Height | 900±20mm | ||
Transport Direction | Left-Right;Right-Left;Left-Left;Right-Right | ||
Transport Speed | Max 1500mm/s（Programmable） | ||
Board Location PCB | Support System | Magnetic Pin/Up-down table adjusted /support block | |
| Clamping System | Side clamping, Automation retractable Z pressure | ||
Printer Head | Two independent motorised printhead | ||
Squeegee Speed | 6~200mm/sec | ||
Squeegee Pressure | 0~15kg | ||
Squeegee Angel | 60° | ||
Squeegee Type | Stainless steel (standard) | ||
Stencil Separation Speed | 0.1~20mm/sec (Programmable) | ||
Cleaning System | Dry 、Wet、Vacuum (Programmable) | ||
Table Adjustment Ranges | X:±10mm;Y:±10mm; θ: ±2° | ||
Solder Paste Inspection | 2D Inspection(Standard) | ||
Repeate Position Accuracy | ±0.01mm | ||
Printing Accuracy | ±0.025mm | ||
Cycle Time | <16s(Exclude Printing & Cleaning) | ||
Product Changeover | <5Min | ||
Air Required | 4.5~6kg/cm2 | ||
Power Input | AC:220 ±10%,50/60HZ,3KW | ||
Control Method | PC Control | ||
Machine Dimensions | 1580(L)×1545(W)×1500(H) mm | ||
Machine Weight | Approx:1500kg | ||
● Automatic Dispensing
● Stencil Detection
● PCB Top Clamping plate
ILIKELEO
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