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All Products In Category:   S-460i | STK-450/STK-650 Series

S-460i Inline SPI Machine

Quick Overview

The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use, and avoid mechanical wear and reduce maintenance costs.

Programmable spatial light modulation(PSLM).

Programmable spatial light modulation(PSLM).

The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use,and avoid mechanical wear and reduce maintenance costs.

 

Phase modulation profiler metry.

Phase modulation profiler metry.

By using the Stop & Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

 

3D Diffuse lighting & active RGB 2D light source

3D Diffuse lighting & active RGB 2D light source

The use of synchronous structure light perfect solve the influence of the shaded part in solder paste inspection. Based on RGB two-dimensional light source, perfect the base board of high contrast. Like black solder mask and ceramic PCB, etc. Meanwhile, we can provide 2D/3D solder paste color images.

 

High resolution image processing system

High resolution image processing system

Standard Ultra-high frames of 5M pixel industrial CCD to ensure that the extremely small components and high precision SMT component were stable and rapid detection.

 

Z axis real time and static vision compensation capability

Z axis real time and static vision compensation capability

The Characteristics of PSLM provide the real-time dynamic tracking on the rigid PCB, for flexible PCB, use static vision compensation to perfectly solve the warpage problems of flexible PCB.

SMT Component Automated Inspection System Features

●  The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use,and avoid mechanical wear and reduce maintenance costs.

●  By using the Stop & Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

●  Patented D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.

●  Gerber data conversion and import, achieve automatic detection of the entire board. Manual "Teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.

●  Friendly and simple user interface, five minutes of programming and one key operation.

●  Powerful "Statistical Process Control (SPC)", provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.

S-460i Inline SPI Machine Specification:

  Model

  S-460i

  Measurement Principle:

  3D white light PSLM PMP (programmable spatial light modulation)

  Measurements:

  volume, acreage, height, XYofiset, shape

  Detection of defective range:

  missing print, insufficient solder, excessive solder, bridging, offset, mal-shapes, surface contamination

  Camera Pixel:

  Standard: 5M

  LensTypes:

  Telecentric lens +coaxial lighting source

  Lens Resolution:

  16um(36*36mm)

  Minimum component size:

  0201 inch

  FOVSpeed:  

  0.45s/FOV

  Quantityof lnspection Head:  

  Single Head

  RGB LightSource:

  standard configuration

  Z axis for compensation of deformed board:  

  standard configuration

  Maximun Meauring Height:

  Standard: ±550um

  Maximun Measuring Heightof PCB Warp:  

  ±5mm

  Minimum Pad Spacing:

  150um

  Maximum PCB Size:  

  L460xW460mm

  Thickness of the PCB:

  0,6-5mm

  Component height limited:  

  up: 30mm down: 40mm

  Board EdgeDistance:

  3mm

  Conveying Direction:  

  left to right

  SPC Statistics:

  Standard configuration

  Geiber & CAD data loading:  

  Standard configuration

  Computer:

  Windows 10 OS (64 bit), English version

  Equipment Diemensionand Weight:  

  W1000 x D1000 x H1580mm

  Power & Air Pressure:

  AC, 220V, 50/60hz, 4~6Bar

  Power (Start/nornmal):  

  start: 2.5kw / normal operation: 2kw

S-460i Inline SPI Machine Includes:

Standard configuration:

● Inline SPI machine S-460i

● 5M pixels industrial camera & telecentric lens

● 3D inspection head (PSLM PMP)

● SPC software

● One year warranty

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