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The cost effective 3D solder paste inspection system are manual and automatic, that monitors three-dimensional inspection of the solder paste to find the optimal parameters of the stencil printer and ensures the production quality.
Off line Desktop Solder Paste Inspection
system PCB is automatically fixed on the
moving table
DetailsOff line Desktop Solder Paste Inspection
system PCB is automatically fixed on the
moving table
The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use, and avoid mechanical wear and reduce maintenance costs.
DetailsThe use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use, and avoid mechanical wear and reduce maintenance costs.
The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
DetailsThe system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
DetailsThe system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
DetailsThe equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
DetailsThe equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
ILIKELEO
Leopeng_keentec
sales@1clicksmt.com