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Reflow Oven

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Inline,batch SMT reflow oven and temperature profiler for SMT processing

  • Power Oven e-Series Reflow Oven

    Power Oven e-Series Reflow Oven

    SIEMENS PLC+PID closed loop control to achieve high precise temperature control and repeatable profiles.

    Details

    SIEMENS PLC+PID closed loop control to achieve high precise temperature control and repeatable profiles.

  • Lead Free Reflow Oven E4/E6

    Lead Free Reflow Oven E4/E6

    300mm wide belt

    980/1540mm heating tunnel

    1920/2550mm overall length

    LCD touch screen control

    Details

    300mm wide belt

    980/1540mm heating tunnel

    1920/2550mm overall length

    LCD touch screen control

  • Auto Infrared IC Heater Reflow Oven T962C

    Auto Infrared IC Heater Reflow Oven T962C

    Max 400×600 mm soldering area

    different soldering cycles are selectable

    Ergonomic design, practical

    and easily operated

    Button panel and LCD display

    Details

    Max 400×600 mm soldering area

    different soldering cycles are selectable

    Ergonomic design, practical

    and easily operated

    Button panel and LCD display

  • Bluetooth 8 Channels Reflow Profiler

    Bluetooth 8 Channels Reflow Profiler

    8 k-type thermocouple inputs (included)

    Far-distance Bluetooth data transmission.

    One-key starts and stops recording

    Analysis software runs on Windows XP

    or Windows 7 system

    Details

    8 k-type thermocouple inputs (included)

    Far-distance Bluetooth data transmission.

    One-key starts and stops recording

    Analysis software runs on Windows XP

    or Windows 7 system

  • Thermal Profiler HC-40/60/12

    Thermal Profiler HC-40/60/12

     4/6/12 k-type thermocouple

    inputs (included)

    One-key starts and stops recording

    Analysis software runs on Windows XP or

    Windows 7 system

    Details

     4/6/12 k-type thermocouple

    inputs (included)

    One-key starts and stops recording

    Analysis software runs on Windows XP or

    Windows 7 system

  • Vapor Phase Reflow Oven VS-500-IV

    Vapor Phase Reflow Oven VS-500-IV

    The main model of the CIF by Exmore range is the vapor phase VS-500.IV. 

    The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while 

    ensuring optimal quality thanks to, 

    • The inert atmosphere resulting from the fluid (medium) used 

    • An incomparable temperature delta across the entire component 

    • No possible handling error during the cycle 


    Details

    The main model of the CIF by Exmore range is the vapor phase VS-500.IV. 

    The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while 

    ensuring optimal quality thanks to, 

    • The inert atmosphere resulting from the fluid (medium) used 

    • An incomparable temperature delta across the entire component 

    • No possible handling error during the cycle 


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