CATEGORIES
Leading designer and manufacturer in the field of selective soldering technology to offers optimal solutions to all requirements.
Fast, accurate printing of solder paste for SMT processing, plus ultrasonic cleaning for stencils.
SMT equipments for all levels of production.
Automatic component inserting system series including robot inserting system for odd shape component insertion, X/Y moudle inserting system for odd shape compnent and standard component insertion, and pin inserting system for terminal pin insertion, it will help you easily realize insertion automation of production line.
Inline, batch SMT reflow oven and temperature profiler for SMT processing
The best performance in fluxing, preheating capability, best wave solder dynamics, complete process flexibility, most extensive process monitoring and control system. Nitrogen is an option
High efficiency soldering system, offline automatic soldering robot, inline automatic soldering robot.
More info at www.1clicksmt-hotbarsoldering.com 
HB4-A4 Hot bar reflow soldering system uses thermode technology based on rapid reflow by pulse heating to effectively bond flexible Board on PCB.
More info at www.1clicksmt-bgarework.com
Differenct classes BGA rework system for BGAs Precision reworking and advanced SMT components.
Automated Optics Inspection System to improve product quality.
More info at www.1clicksmt-pcbhandling.com
Loaders, unloaders, buffer stocker and conveyors for SMT assembly producton.
Table top dispensing machine, high speed inline dispensing system and various valves provide a variety of dispensing solutions.
More info at www.1clicksmt-conformalcoating.com
Table top conformal coating machine, inline conformal coating system and various valves provide a variety of conformal coating solutions.
ICS potting system including Normal pressure potting machine, vacuum potting machine, customized potting machine provide a variety of A/B material potting solutions.
Depend on different glue, use IR or UV oven for curing purpose.
Store moisture-sensitive SMDs and boards or reclaim exposed components to eliminate moisture-related defects.
Manual, automatic PCB router and pneumatic depanelers
More info at www.1clicksmt-autoscrewdriving.com
Automatic screw driving machines including single head machine for 1 kind of screw, double head machine for 2 kinds of screws s and customized machines provide a variety of screw driving solutions.
Quickly and accurately counting process for your component inventory.
PCB defluxing systems, and spray & Ultrasonic stencil cleaners
Semi auto and full auto coaxial cable stripping machine for all level of coaxial cable stripping production.
laser marking system and inkjet printing system provide a variety of barcode processing solution.
Are you interested in more information about this product or service? If so, please fill out the form below and representative will contact you.
No-clean solder wire is the most effective solder with RMA resin core for manual/automatic soldering. This type of cored solder has a unique activation system that provides rapid wettability compared to other RMA cored solders. Its flux which features low residue does not require cleaning and is acceptable in appearance. It can meet GB/T3131-2001 impurity composition control requirements.
|
Shipping information About the World shipping,pls send e-mail to us at sales@1clicksmt sales@1clickmachine.com or call our professional sales engineer at +86-0769-85303739 On Skype: any questions,pls feel free to contact us by skype-oneclickmachine |
|
Suitable applicable for any electronic parts’manual and automatic soldering. It is also suitable for the production of commercial-purpose electronic equipment which conforms to national standards, including electronic computers, aircrafts, radio-based communication equipment, automation equipment, commercial and entertainment machines. RMA resin’s compositions are non-conductive in nature and become active only at the activation temperature. When activation temperature is reduced to the room temperature, they resume their dull state, so the post-solder residue after cooled is highly insulative. RMA resin core’s activation system can solder the following (even moderately gasified) metals such as silver, solder for electroplating, solder for thermal deposition, nickel for electroplating, copper, silver, pure tin for thermal deposition, pure tin for electroplating.
Sn63/Pb37 solder wire Features: | |
No-clean solder wire is the most effective solder with RMA resin core for manual/automatic soldering. This type of cored solder has a unique activation system that provides rapid wettability compared to other RMA cored solders. Its flux which features low residue does not require cleaning and is acceptable in appearance. It can meet GB/T3131-2001 impurity composition control requirements. | |
Metal compositions and contents | |
Metal compositions meet industry specifications as follows: | |
General standards | |
Flux content | □ Solid core □F1 (1.1-1.5%) □F2 (1.6-2.0%) □F3 (2.1-2.5%) □F4 (2.6-3.0%), etc. |
Alloy content | □63/37 □60/40 □55/45 □50/50 □45/55 □40/60, etc. |
Diameter | 0.2~12mm, or tailor-made |
Weight per roll | □500g □800g □1000g, etc. |
Sn63/Pb37 solder wire Alloy compositions: | ||||
Description | Sn63/37 solder wire | Specification | Sn63/Pb37 | |
Seq | Test items | Contents (in WT%) | ||
Alloy compositions are based on the following industry standards | ||||
1 | Tin (Sn) | 63±1.5 | ||
2 | Lead (Pb) | The rest | ||
Impurity limit ≤ | ||||
3 | Stibium (Sb) | ≤1.5 | ||
4 | Bismuth (Bi) | 0.1 | ||
5 | Iron (Fe) | 0.02 | ||
6 | Arsenic (As) | 0.03 | ||
7 | Copper (Cu) | 0.05 | ||
8 | Zinc (Zn) | 0.002 | ||
9 | Alumimium (Al) | 0.005 | ||
10 | Cadmium (Cd) | 0.01 | ||
Note: The above alloys were determined by densitometry. Final tin content = tin content + antimony content | ||||
Flux’s physical and chemical properties | ||
The flux used as solder core belongs to no-clean (NC) type with moderate activity, good soldering effect, transparent residue, non-viscosity, non-corrosiveness and fast wetting. So, it is suitable for high-quality electronic products and can meet the requirements of manual or automatic or fast soldering, especially for soldering process that needs extremely good appearance. | ||
Seq | Item | Requirements |
1 | Flux content | 2.2%±0.2% or tailor-made |
2 | Flux continuity | Uniform flux content without breakage or emptiness |
3 | Chlorine content (wt%) | ≤0.1~0.5 or tailor-formulated |
4 | Copper clad laminate corrosion (4d) | No obvious difference or corrosion signs compared with standard clad laminate |
5 | Copper mirror corrosion | No exposed bottom |
6 | Extension rate (%) | ≥85 |
7 | Residue dryness | Powder can be easily removed from any specimen |
8 | Solid-phase wire | 183℃ |
9 | SLiquid-phase wire | 183℃ |
Packing and labelling |
1. Packing per roll |
● Packed in roll with plastic reel core. |
● Label which indicate alloy compositions, wire diameter, rosin content and unit weight. |
● Each roll is wrapped with a piece of paper to protect the product. |
2. Packing per carton |
● Paper cartons are used. |
● Ten rolls per carton. |
● Label which indicate alloy compositions, wire diameter, rosin content and unit weight. |
3. Packing standards |
● Labels are clear and complete. |
● Solder wires are wound in a neat and uniform way with no tangling and flattening. |
● Tin wire surfaces are kept clean and intact. |
4. A certain length of extension wire should be guaranteed |
5. Shelf life: One year when stored between 0~40℃ |
6. Precautions: Stored in a dry and ventilated place and keep away from moisture |
© 2016-2025 1Clicksmt.com. All Rights Reserved.
ILIKELEO
Leopeng_keentec
sales@1clicksmt.com